Qualcomm Technologies, Inc. today introduced Qualcomm™ ultraSAW filter technology, another breakthrough innovation in its industry-leading wireless technology portfolio. Qualcomm’s heritage of developing groundbreaking technologies, enabling new experiences, and expanding the mobile ecosystem provides a solid foundation for this innovation.
Radio frequency (RF) filters separate the different frequency bands of radio signals transmitted and received by the phone. The Qualcomm ultraSAW filter can achieve a full 1 decibel (dB) improvement in insertion loss, delivering higher performance than competing bulk acoustic wave (BAW) filters in the sub-2.7GHz frequency range.
Qualcomm ultraSAW technology enables superior filter characteristics, enabling high-performance support in the 600MHz to 2.7GHz frequency range and delivering a range of benefits:
Excellent transmit, receive and cross isolation capabilities
high frequency selectivity
Quality factor up to 5000 – significantly higher than that of competing BAW filters
Very low insertion loss
Excellent temperature stability, maintaining very low temperature drift in the single-digit ppm/Kelvin range
Qualcomm ultraSAW technology enables OEMs to implement a more energy-efficient RF path at a lower cost in 5G and 4G multimode mobile terminals than other commercial solutions with similar performance metrics.
Christian Block, senior vice president and general manager of the RF Front-End Business at Qualcomm, said: “Our thin-film SAW technology innovation delivers transformative performance improvements over existing BAW technologies. As the world’s leading wireless technology innovator , Qualcomm continues to push the boundaries of mobile technology with pioneering contributions. As the number and complexity of filters in 5G terminal designs continue to increase, the optimal combination of low cost and high filter performance brought by Qualcomm ultraSAW technology enables our OEM customers Excited.”
Qualcomm ultraSAW is critical to further enhancing the performance of Qualcomm Technologies’ advanced radio frequency front-end (RFFE) portfolio and Qualcomm® Snapdragon™ 5G modem and RF systems. The company is integrating Qualcomm ultraSAW technology across multiple product lines, including Power Amplifier Modules (PAMiD), Front End Modules (FEMiD), Diversity Modules (DRx), Wi-Fi Splitters, GNSS Splitters and RF Multiplexers.
The improvement in RF performance enables OEMs to bring 5G terminals with excellent connectivity and long-lasting battery life to consumers. A series of discrete and integrated products using Qualcomm ultraSAW technology will begin mass production in the first quarter of 2020, and commercial flagship devices from OEMs using the technology are expected to be launched in the second half of 2020.
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