Teledyne e2v cutting-edge multi-core processors to meet new aerospace challenges

Grenoble, France – Media OutReach – April 12, 2021 – Teledyne e2v exclusively offers the tin-lead treated and fully certified QorIQ® T4240 processor to meet the needs of customers in the avionics and aerospace sectors.

The multi-core T4240 unit can handle computationally intensive application scenarios. These devices consist of up to 12 dual-threaded PowerArchitecture® cores (24 virtual cores) clocked up to 1.8GHz for higher performance levels while taking up minimal motherboard space. They feature a wealth of I/O options, including 10Gbit Ethernet, 1Gbit Ethernet, PCIe, USB, SATA, RapidIO, and more. Packet classification and processing efficiency can be significantly improved due to the embedded datapath acceleration logic in each T4240. In addition, a wide operating temperature range of -55°C to 125°C is supported.

In addition to the characterization, screening and qualification of these devices in a high reliability environment (to check that they have the necessary robustness, longevity and performance attributes), Teledyne e2v also offers Sn-Pb ball options for the T4240. This will be a major advantage in applications not subject to RoHS regulations. Due to the test environment, test equipment, test quality and coverage are the same as the original manufacturer NXP, the integrity of these reliability enhancing processors is fully guaranteed in both Sn-Pb and lead-free options.

Power consumption is another critical aspect that needs to be handled, especially for compute-intensive and resource-constrained applications. Here, Teledyne e2v engineers will have in-depth discussions with customers about their specific applications. From this, the power budget requirements (related to static and dynamic power consumption) can be fully understood.

As Thomas Guillemain, Marketing and Business Development Manager at Teledyne e2v semiconductor explains, “Teledyne e2v is in a unique position to offer aerospace customers both tin-lead and lead-free options. Due to the sheer size of the package and the size of the balls involved Quantity, inspecting and certifying this part after tin-lead refill has proven to be a significant challenge. Our comprehensive certification steps and inspection procedures have shown that beyond standard de-balling/re-tining is required to maintain integrity Ball workmanship. Thanks to the measures we have implemented specifically for this component, it is qualified and of the highest level of quality and reliability. This sets us apart from our competitors in the business as we can provide a far superior end product .”

About Teledyne e2v Semiconductor:
Teledyne e2v provides high-performance, ultra-reliable semiconductor solutions addressing critical functions across the entire signal chain, including data converters, interface chips, microprocessors, analog switches, voltage references, digitizers, logic, memory and RF equipment. Serving avionics, industrial, medical, military, scientific and aerospace, the company is recognized as a world leader in redesigning and upgrading commercial technologies to address the toughest application scenarios.

Many of Teledyne e2v’s products are developed through strategic collaborations with leading semiconductor suppliers such as NXP, Everspin and Micron Technology. Working closely with a global customer base, the company is able to offer a wide range of innovative solutions. Covers a range of standard, semi-custom and fully custom solutions.

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